Events

International Symposium on 3D Power Electronics Integration and Manufacturing

Date:2016-05-18 10:55
 
Inaugural 3D Power Electronics Integration and Manufacturing Symposium, June 13-15, 2016, Raleigh, NC, will address the future of power electronics design
 
The first International Symposium on 3D Power Electronics Integration and Manufacturing (www.3D-PEIM.org), to be held June 13-15, 2016, in Raleigh, North Carolina, is now open for registration. The event brings together designers and manufacturers to address the future of integrated power electronics and advance the 3D power electronics systems designs of the future.
The 3D-PEIM Symposium kicks off on Monday morning, June 13th, with a series of tutorials dealing with “The World of Packaging Technologies and Critical Issues”. Sessions will then continue over three days covering manufacturing techniques, modeling and simulation, materials, passive components, and quality and reliability. The 2+ hour evening receptions on Monday and Tuesday provide opportunities for networking and discussions with the Dialogue Presenters and Vendors displaying their latest technologies.
 
The 3D-PEIM symposium is underwritten by the Power Sources Manufacturers Association (PSMA) and is supported by: the International Microelectronics Assembly and Packaging Society (IMAPS); the IEEE Components, Packaging and Manufacturing Technology Society (CPMT); North Carolina State University; the University of Maryland; and Virginia Tech.
 
“This symposium is all about electrical-physical design and the manufacturing of power sources,” said Doug Hopkins, PhD., Professor of Electrical Engineering at NC State and Chairman of 3D-PEIM. “Since we expect nearly everyone will have an interest in ‘physical’ circuits, we’re offering both dialogue and lecture speakers the opportunity to display their hardware during the breaks and receptions.” According to Hopkins, the symposium also offers tutorials to provide “background and insight into many of the traditional physical design approaches and technologies.”
 
Call for Papers
The symposium will consist of oral presentations and interactive dialogue table-top demonstrations. All papers are catalogued in IEEE Xplore. The Call For Dialogue Session Papers is left open to increase participation and expand dialogue between cross-topic areas. Submit a paper and/or come join us!
 
Papers and your attendance are sought to stimulate interactions in creating smaller, lighter, more efficient, and sustainable power electronic products through the following topics:Additive Manufacturing for shortened design cycles, and mass production through the following topics:

 
●Thermal Management and Systems Integration for high-density packaging
●Multiphysics Modeling and Simulation of integrated packaging and circuit solution
●Materials (e.g., interconnects, encapsulants, substrates)
●Active components and integrated driver circuitry for embedded systems
●Passive components (e.g., magnetics, capacitors, interposers) for 3D integration
●Manufacturability of circuits and packaging (manufacturing processes, equipment, and standards)
●Quality and Reliability of integrated solutions, including Prognostics and Condition Monitoring


OPEN PAPER DEADLINE FOR INTERACTIVE DIALOGUE SESSIONS
SUBMISSION FOR DIALOGUE SESSIONS REMAINS OPEN THROUGH–JUNE 06, 2016

DAILOGUE SPEAKERS are provided tables and 2+ hours for discussions
For more information, please check the Symposium website:
www.3D-PEIM.org
Questions pertaining to the 3D-PEIM Symposium may be addressed to:
General Chair: Prof. Douglas Hopkins, NC State University (dchopkins@ncsu.edu)
Technical Program Chairs: Prof. Patrick McCluskey, Univ, of Maryland (mcclupa@umd.edu)
Prof. G.Q. Lu, Virginia Tech (gqlu@vt.edu)